Inorganic filler and organic filler-containing curable resin composition, and method for producing resist film coated printed wiring board

• Main Authors: USUI, YUKIHIRO, KUROYANAGI, YASUHIRO, KUNOU, TOSHIMITSU, OBUNAI, MAKOTO
• Format: Patent
• Language: Chinese; English
• Published: 21.02.2013
• Subjects: APPARATUS SPECIALLY ADAPTED THEREFOR; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CHEMISTRY; CINEMATOGRAPHY; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; ELECTROGRAPHY; HOLOGRAPHY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; MATERIALS THEREFOR; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; ORIGINALS THEREFOR; PHOTOGRAPHY; PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES; PHYSICS; PRINTED CIRCUITS; THEIR PREPARATION OR CHEMICAL WORKING-UP; USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS

A curable resin composition is provided to be suitable for resist ink for a white printed circuit board applying light reflection, crack resistance and yellowing resistance. A curable resin composition comprises (i) curable resin of 100.0 parts by weight, (ii) inorganic filler of 10-1200 parts by weight, and (iii) organic filler having elastic modulus of 1-2000 (MPa) and the average particle diameter of 0.01-10 micron. The content weight ratio of the component (II) to (III) is 1-41. The component (II) is white pigment and/or a material having thermal conductivity of 1.0-500 (W/m.K).