TWI381062B

• Main Authors: KOMATSU, TAKASHI, OOISHI, YUUICHI, KIYOTA, JUNYA, NAKAMURA, HAJIME, TANI, NORIAKI, ARAI, MAKOTO
• Format: Patent
• Language: Chinese
• Published: 01.01.2013
• Subjects: CHEMICAL SURFACE TREATMENT; CHEMISTRY; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING MATERIAL WITH METALLIC MATERIAL; COATING METALLIC MATERIAL; DIFFUSION TREATMENT OF METALLIC MATERIAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL; METALLURGY; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION

The objective of this invention is to spattering coating the target assembly through joining surfaces between the targets and the base plate will not expose to plasma, when the target and the base plate is joined by means of welding, so as to prevent abnormal discharge during sputtering process. This invention proposed to make the contact area between the particular shaped targets (31a-31f) and the base plate (32a-32f) is less than the maximum cross section area of the targets.