Wiring board and semiconductor device

A wiring board where an electronic component is mounted on a main surface via a bump and at least a part of the periphery of the electronic component is covered with resin, the wiring board includes a dam provided at least at a part of the periphery of an area where the electronic component is mount...

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Bibliographic Details
Main Authors NISHIMURA, TAKAO, AIBA, KAZUYUKI
Format Patent
LanguageChinese
English
Published 01.10.2012
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:A wiring board where an electronic component is mounted on a main surface via a bump and at least a part of the periphery of the electronic component is covered with resin, the wiring board includes a dam provided at least at a part of the periphery of an area where the electronic component is mounted, on the main surface of the wiring board; wherein a surface of the dam contacting the resin has a configuration where a curved line is continuously formed.
Bibliography:Application Number: TW200897100158