Assembly

An assembly includes a substrate, a device coupled to the substrate; a ring formed on the substrate; and one or more bonding pads formed on the substrate, wherein the ring and bonding pads are formed of a same material.

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Bibliographic Details
Main Authors CRAIG, DAVID M, YENCHIK, RONNIE J, CHEN, CHIEN-HUA, HALUZAK, CHARLES C
Format Patent
LanguageChinese
English
Published 21.06.2012
Subjects
MICROSTRUCTURAL TECHNOLOGY
PERFORMING OPERATIONS
PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTUREOR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
TRANSPORTING
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Summary:An assembly includes a substrate, a device coupled to the substrate; a ring formed on the substrate; and one or more bonding pads formed on the substrate, wherein the ring and bonding pads are formed of a same material.
Bibliography:Application Number: TW200594132292