Methods of fabricating metal contact structures for laser diodes using backside uv exposure

• Main Authors: JINGQUN XI, CHUNG-EN ZAH
• Format: Patent
• Language: Chinese; English
• Published: 21.05.2012
• Subjects: BASIC ELECTRIC ELEMENTS; DEVICES USING STIMULATED EMISSION; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

Methods of fabricating a metal contact structure for a laser diodes are provided, wherein the method comprises providing a UV transparent semiconductor substrate, a UV transparent semiconductor epilayer defining a ridge disposed between etched epilayer edges, the epilayer being disposed over the UV...