Methods and system for reinforcing a bond pad

Disclosed herein is a reinforcing system and method for reinforcing a contact pad of an integrated circuit. Specifically exemplified is a system and method that comprises a reinforcing structure interposed between a top contact pad layer and an underlying metal layer.

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Bibliographic Details
Main Authors STEINER, KURT GEORGE, OSENBACH, JOHN WILLIAM, CHESIRE, DANIEL PATRICK, MERCHANT, SAILESH MANSINH, BACHMAN, MARK
Format Patent
LanguageChinese
English
Published 21.05.2012
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:Disclosed herein is a reinforcing system and method for reinforcing a contact pad of an integrated circuit. Specifically exemplified is a system and method that comprises a reinforcing structure interposed between a top contact pad layer and an underlying metal layer.
Bibliography:Application Number: TW200493127180