Padless substrate for surface mounted components
A semiconductor package having a low profile is disclosed. In embodiments, a surface mounted component may be mounted directly to the core of the semiconductor package substrate, so that there is no conductive layer, plating layers or solder paste between the component and the substrate core. The su...
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Main Authors | , , , , , , , |
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Format | Patent |
Language | Chinese English |
Published |
11.02.2012
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Subjects | |
Online Access | Get full text |
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Abstract | A semiconductor package having a low profile is disclosed. In embodiments, a surface mounted component may be mounted directly to the core of the semiconductor package substrate, so that there is no conductive layer, plating layers or solder paste between the component and the substrate core. The surface mounted component may be any type of component which may be surface mounted on a substrate according to an SMT process, including for example passive components and various packaged semiconductors. |
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AbstractList | A semiconductor package having a low profile is disclosed. In embodiments, a surface mounted component may be mounted directly to the core of the semiconductor package substrate, so that there is no conductive layer, plating layers or solder paste between the component and the substrate core. The surface mounted component may be any type of component which may be surface mounted on a substrate according to an SMT process, including for example passive components and various packaged semiconductors. |
Author | TAKIAR, HEM CHIU, CHIN TIEN BHAGATH, SHRIKAR YU, CHEEMEN WANG, KEN JIAN MING CHIEN, JACK CHANG LIAO, CHIH CHIN CHEN, HAN SHIAO |
Author_xml | – fullname: YU, CHEEMEN – fullname: TAKIAR, HEM – fullname: CHEN, HAN SHIAO – fullname: LIAO, CHIH CHIN – fullname: WANG, KEN JIAN MING – fullname: BHAGATH, SHRIKAR – fullname: CHIU, CHIN TIEN – fullname: CHIEN, JACK CHANG |
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Snippet | A semiconductor package having a low profile is disclosed. In embodiments, a surface mounted component may be mounted directly to the core of the semiconductor... |
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SubjectTerms | CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS |
Title | Padless substrate for surface mounted components |
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