Padless substrate for surface mounted components

A semiconductor package having a low profile is disclosed. In embodiments, a surface mounted component may be mounted directly to the core of the semiconductor package substrate, so that there is no conductive layer, plating layers or solder paste between the component and the substrate core. The su...

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Bibliographic Details
Main Authors YU, CHEEMEN, TAKIAR, HEM, CHEN, HAN SHIAO, LIAO, CHIH CHIN, WANG, KEN JIAN MING, BHAGATH, SHRIKAR, CHIU, CHIN TIEN, CHIEN, JACK CHANG
Format Patent
LanguageChinese
English
Published 11.02.2012
Subjects
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
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Summary:A semiconductor package having a low profile is disclosed. In embodiments, a surface mounted component may be mounted directly to the core of the semiconductor package substrate, so that there is no conductive layer, plating layers or solder paste between the component and the substrate core. The surface mounted component may be any type of component which may be surface mounted on a substrate according to an SMT process, including for example passive components and various packaged semiconductors.
Bibliography:Application Number: TW200695142304