Packing structure for semiconductor device, packin

• Main Authors: TOYOSAWA, KENJI, KUDOSE, SATORU
• Format: Patent
• Language: Chinese; English
• Published: 21.01.2012
• Subjects: ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; BASIC ELECTRIC ELEMENTS; CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS,e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES,DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; CONVEYING; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; HANDLING THIN OR FILAMENTARY MATERIAL; PACKAGES; PACKAGING ELEMENTS; PACKING; PERFORMING OPERATIONS; SEMICONDUCTOR DEVICES; STORING; TRANSPORTING

A TAB tape (100) packaging structure in which (i) the TAB tape (100) including a plurality of semiconductor chips (103) which are fixed, on a film (101) on which wiring patterns are repeatedly provided and (ii) an embossed tape (200) which is electroconductive and has embossed parts (202) which are sequentially provided on a first surface of and in a longitudinal direction of a film (201) are wound on a reel which is electroconductive is arranged such that the TAB tape (100) and the embossed tape (200) are wound on the reel, while (i) a first surface of the film (101) on which surface the plurality of semiconductor chips (103) are fixed and (ii) the first surface of the film (201) on which surface the embossed parts (202) protrude are overlapping and facing each other, and the embossed tape (200) has a total thickness of not less than (t+0.4) mm and not more than 1.1 mm in a case where each of the plurality of semiconductor chips (103) has a thickness of t (0.2 t 0.625) mm and the film (201) has a substantial