Method of forming a polishing pad having reduced s

• Main Authors: NORTON, KARI-ELL, SAIKIN, ALAN H, NOVEMBER, SAMUEL J, ROBERTSON, MALCOLM W, LEVITON, ALAN E, KOETAS, JOSEPH P
• Format: Patent
• Language: Chinese; English
• Published: 21.11.2011
• Subjects: AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G; CHEMISTRY; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS; GENERAL PROCESSES OF COMPOUNDING; GRINDING; MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; PERFORMING OPERATIONS; POLISHING; THEIR PREPARATION OR CHEMICAL WORKING-UP; TOOLS FOR GRINDING, BUFFING, OR SHARPENING; TRANSPORTING; WORKING-UP

The present invention provides a method of forming a chemical mechanical polishing pad, comprising providing a tank with polymeric materials and providing a storage hopper with microspheres having an initial bulk density, wherein the storage hopper further comprises a porous membrane provided over a plenum. The method further provides the steps of connecting a fluidizing gas source to the plenum through a gas inlet line and fluidizing the microspheres and reducing the initial bulk density by feeding gas into the plenum. In addition, the method further provides the steps of providing a delivery system for delivering the polymeric materials and the microspheres to a mixer, forming a mixture of the polymeric materials and the microspheres, pouring the mixture into a mold to form a molded product and cutting the molded product into the polishing pad.