Glass package and method for manufacturing an optical device and glass package

A hermetically sealed glass package and method for manufacturing the hermetically sealed glass package are described herein. In one embodiment, the hermetically sealed glass package is suitable to protect thin film devices which are sensitive to the ambient environment. Some examples of such glass p...

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Bibliographic Details
Main Authors KAMJULA PATTABHIRAMI REDDY, JOSEPH F. SCHROEDER, STEPHAN L. LOGUNOV, KEITH J. BECKEN, HOLLY J. STRZEPEK
Format Patent
LanguageChinese
English
Published 01.04.2011
Subjects
ELECTRIC HEATING
ELECTRIC LIGHTING NOT OTHERWISE PROVIDED FOR
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
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Summary:A hermetically sealed glass package and method for manufacturing the hermetically sealed glass package are described herein. In one embodiment, the hermetically sealed glass package is suitable to protect thin film devices which are sensitive to the ambient environment. Some examples of such glass packages are organic emitting light diode (OLED) displays, sensors, and other optical devices. The present invention is demonstrated using an OLED display as an example.
Bibliography:Application Number: TW200594136651