A prepreg comprising a substrate impregnated with a thermally conductive resin, a laminate comprising the prepreg, a printed wiring board comprising the laminate, and methods of constructing the prepreg, the laminate and the printed wiring board
Prepregs, laminates, printed wiring board structures and processes for constructing materials and printed wiring boards that enable the construction of printed wiring boards with improved thermal properties. In one embodiment, the prepregs include substrates impregnated with electrically and thermal...
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Main Authors | , , , |
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Format | Patent |
Language | Chinese English |
Published |
11.03.2011
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Subjects | |
Online Access | Get full text |
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Summary: | Prepregs, laminates, printed wiring board structures and processes for constructing materials and printed wiring boards that enable the construction of printed wiring boards with improved thermal properties. In one embodiment, the prepregs include substrates impregnated with electrically and thermally conductive resins. In other embodiments, the prepregs have substrate materials that include carbon. In other embodiments, the prepregs include substrates impregnated with thermally conductive resins. In other embodiments, the printed wiring board structures include electrically and thermally conductive laminates that can act as ground and/or power planes. |
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Bibliography: | Application Number: TW200998105098 |