Photosensitive resin composition using photopolymer
PURPOSE: A photosensitive resin composition using a photopolymer is provided to enhance a developing characteristic under a small quantity of exposure by using a resin having a crosslinkable photopolymer. CONSTITUTION: A photosensitive resin composition using a photopolymer includes a macro-polymer...
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Main Authors | , , |
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Format | Patent |
Language | Chinese English |
Published |
01.02.2009
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Subjects | |
Online Access | Get full text |
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Summary: | PURPOSE: A photosensitive resin composition using a photopolymer is provided to enhance a developing characteristic under a small quantity of exposure by using a resin having a crosslinkable photopolymer. CONSTITUTION: A photosensitive resin composition using a photopolymer includes a macro-polymer of 1 to 30 weight percent, a crosslinkable monomer of 5 to 10 weight percent, paints of 10 to 60 percent, a photopolymerization initiator of 0.5 to 5 weight percent, and a solvent of 20 to 80 weight percent. The macro-polymer is expressed by a predetermined chemical formula. The macro-polymer has an average molecular weight of 10,000 to 40,000. The crosslinkable monomer has two or more ethylene-based dual bonds. |
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Bibliography: | Application Number: TW200392127353 |