Precursor solution for polyimide/silica composite material, its manufacture method and polyimide/silica composite material having low volume shrinkage

Saved in:
Bibliographic Details
Main Authors CHEN, WEN CHANG, LU, SHU WAN, CHANG, CHUNG HUNG, HUANG, HSIN WEI, CHOU, MENG YEN, WU, CHUNG HAO, HSIEH, KUO HUANG, WANG, MIN CHI, YEN, CHENG TYNG, CHUANG, CHIN CHANG, AN, CHIH MIN, WU, CHUNG JEN, WANG, YU WEN
Format Patent
LanguageChinese
English
Published 21.06.2008
Subjects
Online AccessGet full text

Cover

Loading…
More Information
Bibliography:Application Number: TW20040112308