Package structure having recession portion on the surface thereof and method of making the same

• Main Authors: HONG, JIN-YOUNG, LEE, YOUNG-GIL, KIM, SONG-WOON, KIM, BAE-DOO, PARK, SANG-BAE
• Format: Patent
• Language: English
• Published: 11.08.2007
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

The present invention relates to a method for making a package structure having recession portion on the surface thereof. The method comprising: (a) providing a lead frame having a plurality of package units, each package unit having a plurality of leads and a die paddle; (b) providing an upper mold and a lower mold for clamping the lead frame, wherein the upper mold and the protrudent block of the lower mold clamp the first portions of the leads so as to prevent molding compound bleed to the top surface of the leads; (c) filling a molding compound between the upper mold and the lower mold, and forming a plurality of accommodating space; (d) attaching a plurality of dies onto the die paddles; (e) electrically connecting the dies to the wire bonding portions of the leads; (f) sealing the accommodating space; and (g) segregating the package units.