Method for bonding reinforcing plate

A method for bonding a reinforcing plate to a flexible substrate, the method comprising the steps of: laminating a sheet-shaped thermosetting adhesive on a plate-like polyimide resin to prepare a reinforcing plate; drying the reinforcing plate so that its water content is decreased to the maximum al...

Full description

Saved in:
Bibliographic Details
Main Author NAITOH, KATSUYUKI
Format Patent
LanguageEnglish
Published 11.04.2007
Subjects
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
Online AccessGet full text

Cover

More Information
Summary:A method for bonding a reinforcing plate to a flexible substrate, the method comprising the steps of: laminating a sheet-shaped thermosetting adhesive on a plate-like polyimide resin to prepare a reinforcing plate; drying the reinforcing plate so that its water content is decreased to the maximum allowable level or less; bonding the reinforcing plate to the flexible substrate through the adhesive by thermocompression bonding; and actually curing the adhesive by heating.
Bibliography:Application Number: TW20040118131