Forming method for the micro wick structure inside the heat pipe

• Main Authors: SHYU, JINRNG, YEH, LAN-KAI, CHIANG, CHIA-SHENG, TSAI, MING-JYE, CHUNG, CHENG-TAI
• Format: Patent
• Language: English
• Published: 21.03.2007
• Subjects: BLASTING; DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OFGENERAL APPLICATION; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; HEAT EXCHANGE IN GENERAL; HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS,IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT; HEATING; LIGHTING; MECHANICAL ENGINEERING; TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION; TECHNICAL SUBJECTS COVERED BY FORMER USPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS; WEAPONS

The present invention is to provide a forming method for the micro wick structure inside the heat pipe, comprising the following procedures: A flat plate (31) and a mold (32) with several mold holes (321) are provided. The powder material (33) is filled in these mold holes (321), and the mold (32) is placed onto the flat plate (31) to cover the plate (31) to form a to-be-sintered body (34). The to-be-sintered body (34) is sintered, and then the mold (32) is removed to form the flat plate with micro wick structure (3). The micro wick structure is formed on the plate (3) with the morphology of micro grooved, micro pillars and any combination or arrangement of the groove and pillar. The flat plate (3) with micro wick structure is machined to form the heat pipe having characteristic profile and two kinds of wick structure to promote the heat transfer capacity of the heat pipe and delay the drying out of the heat pipe.