Method for increasing heat-dissipating efficiency of a heat-dissipating device and the structure thereof

A method for increasing heat-dissipating efficiency of a heat-dissipating device and the structure thereof are disclosed. The method includes steps of: (a) providing the heat-dissipating device; (b) adhering an adhesive layer onto whole or partial surfaces of the heat-dissipating device; and (c) dis...

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Bibliographic Details
Main Authors YEH, WEN-YI, CHIEN, SHIH-KAI, HSU, JUI-YUAN
Format Patent
LanguageEnglish
Published 01.03.2007
Subjects
BASIC ELECTRIC ELEMENTS
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
SEMICONDUCTOR DEVICES
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Summary:A method for increasing heat-dissipating efficiency of a heat-dissipating device and the structure thereof are disclosed. The method includes steps of: (a) providing the heat-dissipating device; (b) adhering an adhesive layer onto whole or partial surfaces of the heat-dissipating device; and (c) disposing the heat-dissipating device on a printed circuit board for dissipating heat generated from electronic components on the printed circuit board under a natural convection environment. The present technique can not only alter the irradiation rate on the surfaces of the heat-dissipating device to increase the heat-dissipating efficiency, but also reduce the cost. Further, the present technique is easy to control, adjust, and redesign.
Bibliography:Application Number: TW20050125932