Method for exposing a semiconductor wafer

A method for exposing a semiconductor wafer is provided, which provides a compensation of the effects of process inhomogeneities, e.g. in semiconductor etching or deposition processes, by adjusting sets of exposure parameters (30), preferably dose and focus, of an exposure tool for any exposure fiel...

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Bibliographic Details
Main Authors SCHEDEL, THORSTEN, SEIDEL, TORSTEN
Format Patent
LanguageEnglish
Published 01.02.2007
Subjects
APPARATUS SPECIALLY ADAPTED THEREFOR
BASIC ELECTRIC ELEMENTS
CINEMATOGRAPHY
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
ELECTROGRAPHY
GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC
GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS
HOLOGRAPHY
MATERIALS THEREFOR
ORIGINALS THEREFOR
PHOTOGRAPHY
PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES
PHYSICS
SEMICONDUCTOR DEVICES
TECHNICAL SUBJECTS COVERED BY FORMER USPC
TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ARTCOLLECTIONS [XRACs] AND DIGESTS
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Summary:A method for exposing a semiconductor wafer is provided, which provides a compensation of the effects of process inhomogeneities, e.g. in semiconductor etching or deposition processes, by adjusting sets of exposure parameters (30), preferably dose and focus, of an exposure tool for any exposure field (21) individually across a semiconductor wafer (10).
Bibliography:Application Number: TW20010126744