Adhesive tape and substrate for adhesive tape

• Main Authors: NATSUME, MASAYOSHI, ISHIGURO, SHIGEKI, NAKAGAWA, YOSHIO, TAKADA, SHINICHI, OOYAMA, KOOKI
• Format: Patent
• Language: English
• Published: 21.01.2007
• Subjects: ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; ADHESIVES; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G; CHEMISTRY; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; DYES; GENERAL PROCESSES OF COMPOUNDING; METALLURGY; MISCELLANEOUS APPLICATIONS OF MATERIALS; MISCELLANEOUS COMPOSITIONS; NATURAL RESINS; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ORGANIC MACROMOLECULAR COMPOUNDS; PAINTS; POLISHES; THEIR PREPARATION OR CHEMICAL WORKING-UP; USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS; USE OF MATERIALS AS ADHESIVES; WORKING-UP

The present invention provides an adhesive tape containing a substrate and an adhesive layer formed on at least one side of the substrate, wherein the substrate contains an olefin polymer and a flame retardant, but substantially no halogen atom, and the adhesive tape has a thermal deformation at 100 DEG C of not more than 65%. The present invention also provides a substrate containing an olefin polymer and a flame retardant, but substantially no halogen atom, wherein the olefin polymer contains the following component A and component B: component A: a thermoplastic resin having a carbonyl oxygen atom in the molecular skeleton; component B: a polymer alloy containing an ethylene component and a propylene component. The adhesive tape and the substrate for the adhesive tape of the present invention are free of generation of dioxin and toxic gas upon incineration, and show superior resistance to thermal deformation, flame resistance and superior stretchability in combination.