Bonding device of ultrasonic oscillation

• Main Authors: HSU, JIA-BIN, LIU, CHUN-BIN, HUANG, GUO-SHING, CHEN, WEI-YU, CHEN, LONG-TAI
• Format: Patent
• Language: English
• Published: 01.12.2006
• Edition: 7
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

A bonding device of ultrasonic oscillation is disclosed, comprising an oscillation member wherein at least one oscillation generator is disposed at the two ends used to drive the oscillation member to make an oscillation part of the oscillation member to generate a high frequency oscillation in the...