Bonding device of ultrasonic oscillation

• Main Authors: HSU, JIA-BIN, LIU, CHUN-BIN, HUANG, GUO-SHING, CHEN, WEI-YU, CHEN, LONG-TAI
• Format: Patent
• Language: English
• Published: 01.12.2006
• Edition: 7
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

A bonding device of ultrasonic oscillation is disclosed, comprising an oscillation member wherein at least one oscillation generator is disposed at the two ends used to drive the oscillation member to make an oscillation part of the oscillation member to generate a high frequency oscillation in the axis direction, and a friction plate disposed at one side of the oscillation part and having a contact part able to contact to a chip ready for packaging so as to put pressure upon the chip and to drive the chip to generate high frequency oscillation to make the chip rub against the electrode of a substrate and to enable to the metal between the contact electrodes to generate atom attraction by rubbing for heat to achieve the purpose of soldering together the chip and the circuit connecting point of the substrate. Said friction plate is a flat flake body made of material with rubbing resistance and uses a screw to latch up onto the surface of the oscillation member so as to change the proper size of the friction plate according to the chip ready for packaging and to quickly replace the friction plate when it is worn out. In the invention, the light-mass design of the friction plate can reduce the influence of the oscillator on the resonance type coming from the extra mass in order to package bigger chips.