Solder composition and method for forming bump by using the same

• Main Authors: FURUNO, MASAHIKO, SAITO, HIROSHI, SAKAMOTO, ISAO, ONOZAKI, JUNICHI, ANDOU, HARUHIKO
• Format: Patent
• Language: English
• Published: 01.12.2006
• Edition: 7
• Subjects: BASIC ELECTRIC ELEMENTS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MACHINE TOOLS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; METAL-WORKING NOT OTHERWISE PROVIDED FOR; PERFORMING OPERATIONS; PRINTED CIRCUITS; SEMICONDUCTOR DEVICES; SOLDERING OR UNSOLDERING; TRANSPORTING; WELDING; WORKING BY LASER BEAM

This invention provides a solder composition and a method of forming bump by using the same, by which the process of dispensing said solder composition onto a substrate can be simplified. The solder composition 10 of present invention is formed by a liquid matter 12 and solder particles 11. The liquid matter 12 includes a flux composition, the reaction temperature of which is near the temperature of the melting point of said solder particles, and which has a viscosity enabling the liquid matter to flow in normal temperature as well as stacked on the substrate in laminated way. The solder particles 11 can be precipitated directed onto the substrate within the liquid matter 12, and has a mixing ratio and a particle diameter in such a way that it can be dispersed homogeneously within the liquid matter 12.