Resin sealing apparatus and resin sealing method

• Main Author: MIURA, MUNEO
• Format: Patent
• Language: English
• Published: 21.04.2006
• Edition: 7
• Subjects: AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING; BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULARARTICLES; INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS; PERFORMING OPERATIONS; SEMICONDUCTOR DEVICES; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR; SHAPING OR JOINING OF PLASTICS; TRANSPORTING; WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL

A pot block (9) is fitted in a lower mold section (1) having a substrate block (5). A coil spring (21) elastically supports the pot block (9) to be movable in contact with the substrate block (5). When an upper mold section (2) and a lower mold section (1) are closed, the upper mold section (2) and the substrate block (5) hold a substrate (16) therebetween with a proper clamp pressure, and the coil spring (21) presses the pot block (9) against the upper mold section (2) with a proper pressure. When the upper mold section (2) and the lower mold section (1) are released from mold closing, the coil spring (21) extends to move the pot block (9) upward in contact with the substrate block (5). Consequently, a resin sealing apparatus preventing formation of a resin burr between the pot block (9) and the upper mold section (2), damage of the substrate (16) and requirement for adjustment of the vertical position of the substrate (16) with disc (conical) springs or the like is obtained.