Lithographic apparatus and device manufacturing method

In a purge gas system for a lithographic apparatus, a rate of flow of purge gas to the system is reduced substantially once a contamination level has fallen below a threshold level. The control may be on the basis of a detected level of contamination or on the basis of a timetable.

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Bibliographic Details
Main Authors TEUNISSEN, FRANCISCUS JOHANNES, HERMAN MARIA, VAN DER NET ANTONIUS, JOHANNES, LOCK, WILLEM
Format Patent
LanguageEnglish
Published 11.03.2006
Edition7
Subjects
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Summary:In a purge gas system for a lithographic apparatus, a rate of flow of purge gas to the system is reduced substantially once a contamination level has fallen below a threshold level. The control may be on the basis of a detected level of contamination or on the basis of a timetable.
Bibliography:Application Number: TW20030125039