Composition for the removal of sidewall residues

The present invention relates to a composition for the removal of so-called sidewall residues from metal surfaces, in particular from aluminium or aluminium-containing surfaces, during the production of semiconductor elements. Composition for the removal of residual polymers from aluminium or copper...

Full description

Saved in:
Bibliographic Details
Main Authors BOERNER, MARC, BARKO, ANDREA, MELLIES, RAIMUND, ARNOLD, LUCIA, RHEIN, RUDOLF
Format Patent
LanguageEnglish
Published 11.02.2006
Edition7
Subjects
ANIMAL AND VEGETABLE OILS, FATS, FATTY SUBSTANCES AND WAXES
APPARATUS SPECIALLY ADAPTED THEREFOR
BASIC ELECTRIC ELEMENTS
CANDLES
CHEMISTRY
CINEMATOGRAPHY
DETERGENT COMPOSITIONS
DETERGENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
ELECTROGRAPHY
FATTY ACIDS THEREFROM
HOLOGRAPHY
MATERIALS THEREFOR
METALLURGY
ORIGINALS THEREFOR
PHOTOGRAPHY
PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES
PHYSICS
RECOVERY OF GLYCEROL
RESIN SOAPS
SEMICONDUCTOR DEVICES
SOAP OR SOAP-MAKING
USE OF SINGLE SUBSTANCES AS DETERGENTS
Online AccessGet full text

Cover

More Information
Summary:The present invention relates to a composition for the removal of so-called sidewall residues from metal surfaces, in particular from aluminium or aluminium-containing surfaces, during the production of semiconductor elements. Composition for the removal of residual polymers from aluminium or copper/aluminium alloys in a process step in the production of semiconductors, comprising H2SiF6 and/or HBF4 in a total amount of 10-500 mg/kg, 12-17% by weight of H2SO4, 2-4% by weight of H2O2, optionally in combination with additives, in aqueous solution.
Bibliography:Application Number: TW200392116289