Method for connecting microcircuits and connection structure by the same

• Main Authors: PETER, CHUCKSIN, LEE, MYUNG-KYU, LEE, KYUNG-JUN, BYUN, JEONG-II
• Format: Patent
• Language: English
• Published: 01.02.2006
• Edition: 7
• Subjects: BASIC ELECTRIC ELEMENTS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS; SEMICONDUCTOR DEVICES

Disclosed is a method for connecting microcircuits formed in a circuit board, such as a tape carrier package (TCP), a flexible printed circuit (FPC), a liquid crystal display (LCD) or a printed circuit board using an anisotropic conductive adhesive including conductive particles, and the connection structure manufactured by the above method. The method comprises the steps of applying an insulating film layer to a circuit board having circuit patterns, and then bonding them with an anisotropic conduction adhesive. The circuit that should not be connected by conductive particles included in the anisotropic conductive adhesive are prevented from a short-circuit.