Method for connecting microcircuits and connection structure by the same

Disclosed is a method for connecting microcircuits formed in a circuit board, such as a tape carrier package (TCP), a flexible printed circuit (FPC), a liquid crystal display (LCD) or a printed circuit board using an anisotropic conductive adhesive including conductive particles, and the connection...

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Bibliographic Details
Main Authors PETER, CHUCKSIN, LEE, MYUNG-KYU, LEE, KYUNG-JUN, BYUN, JEONG-II
Format Patent
LanguageEnglish
Published 01.02.2006
Edition7
Subjects
BASIC ELECTRIC ELEMENTS
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
SEMICONDUCTOR DEVICES
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Summary:Disclosed is a method for connecting microcircuits formed in a circuit board, such as a tape carrier package (TCP), a flexible printed circuit (FPC), a liquid crystal display (LCD) or a printed circuit board using an anisotropic conductive adhesive including conductive particles, and the connection structure manufactured by the above method. The method comprises the steps of applying an insulating film layer to a circuit board having circuit patterns, and then bonding them with an anisotropic conduction adhesive. The circuit that should not be connected by conductive particles included in the anisotropic conductive adhesive are prevented from a short-circuit.
Bibliography:Application Number: TW200493100277