Packaging structure and process for avoiding contact between heat slug and golden wires

A packaging structure and process for avoiding the contact between heat slug and golden wires are provided. A spacer and a flexible element are arranged and fixed on the top of a chip to against the excessive deformation of the heat slug in the molding process, avoiding the down press to the golden...

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Bibliographic Details
Main Authors HUANG, SHIH-MING, WANG, CHINN
Format Patent
LanguageEnglish
Published 21.01.2006
Edition7
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:A packaging structure and process for avoiding the contact between heat slug and golden wires are provided. A spacer and a flexible element are arranged and fixed on the top of a chip to against the excessive deformation of the heat slug in the molding process, avoiding the down press to the golden wires.
Bibliography:Application Number: TW20050113421