Method and apparatus for coating with resist

• Main Author: TAKAMORI, HIDEYUKI
• Format: Patent
• Language: English
• Published: 01.01.2006
• Edition: 7
• Subjects: APPARATUS FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL; APPARATUS SPECIALLY ADAPTED THEREFOR; APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL; BASIC ELECTRIC ELEMENTS; CINEMATOGRAPHY; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; ELECTROGRAPHY; HOLOGRAPHY; MATERIALS THEREFOR; ORIGINALS THEREFOR; PERFORMING OPERATIONS; PHOTOGRAPHY; PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES; PHYSICS; PROCESSES FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL; SEMICONDUCTOR DEVICES; SPRAYING OR ATOMISING IN GENERAL; TRANSPORTING

This invention provide a method and an apparatus for coating with resist, which can keep the film thickness of a resist film uniform by suppressing a movement of a resist liquid coating a substrate to be processed during a drying process. A resist nozzle head 154 moves along a route shown by a chain line A, and sequentially scans to coat in first to third rows. More particularly, a liquid crystal panel region S of each row is longitudinally moved in a direction Y, and only each coating region E (shaded regions in figure) is coated with the resist liquid in a limited manner. Thus, only the coating region E corresponding to the liquid crystal panel region S of the surface to be processed of the substrate G is coated with the resist liquid in a substantially constant film thickness. A blank region in which the resist liquid film does not exist, is retained in a gap (d) between coating regions E and E is adjacently brought into contact with the peripheral edge of the substrate.