Method for electrostatic discharge for mother board

Disclosed is a method for electrostatic discharge for a mother board, in which a plurality of holes are formed in the grounding side of the input/output port where the electrostatic charge is most likely to build and is attached to a chassis by metal wires or bolts so as to remove the electrostatic...

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Bibliographic Details
Main Author HSIEH, HUNGIH
Format Patent
LanguageEnglish
Published 11.11.2005
Edition7
Subjects
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
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Summary:Disclosed is a method for electrostatic discharge for a mother board, in which a plurality of holes are formed in the grounding side of the input/output port where the electrostatic charge is most likely to build and is attached to a chassis by metal wires or bolts so as to remove the electrostatic charge through metal contact between the metal wires or bolts and the chassis. Conductive traces that originally connect points that are distributed on the mother board and fixed by bolts to the grounding side of the input/output port are removed so as to limit the electrostatic charge to be drained only through the holes formed in the grounding side of the input/output port to the chassis thereby eliminating the interference problem caused by the electrostatic charges randomly moving over the bolt holes around the mother board.
Bibliography:Application Number: TW20040109476