Package for semiconductor components and method for producing the same

• Main Authors: LUDEWIG, SYLKE, ZACHERL, JUERGEN, BLASZCZAK, STEPHAN, REISS, MARTIN
• Format: Patent
• Language: English
• Published: 21.09.2005
• Edition: 7
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

The invention relates to a package for semiconductor components, such as FBGA packages in BOC technology or the like, in which at least the rear side and the side edges of a chip mounted on a substrate are enclosed by a moulding covering, the potting compound used for the moulding covering being connected to the substrate, in a manner forming a compact unit. The invention furthermore relates to a method for producing such a package for semiconductor components. The invention is intended to provide a package for semiconductor components which achieves a significantly higher package loading through lower thermomechanical stress and, at the same time, a significantly better adhesion of the moulding covering on the substrate. This is achieved by virtue of the fact that the substrate (1) has, at least partially, a sponge-like structure (7) which is provided with porous openings and extends from the surface into the depth, so that moulding material can penetrate into the substrate (1) through capillary action.