Package for semiconductor components and method for producing the same
The invention relates to a package for semiconductor components, such as FBGA packages in BOC technology or the like, in which at least the rear side and the side edges of a chip mounted on a substrate are enclosed by a moulding covering, the potting compound used for the moulding covering being con...
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Main Authors | , , , |
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Format | Patent |
Language | English |
Published |
21.09.2005
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Edition | 7 |
Subjects | |
Online Access | Get full text |
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Summary: | The invention relates to a package for semiconductor components, such as FBGA packages in BOC technology or the like, in which at least the rear side and the side edges of a chip mounted on a substrate are enclosed by a moulding covering, the potting compound used for the moulding covering being connected to the substrate, in a manner forming a compact unit. The invention furthermore relates to a method for producing such a package for semiconductor components. The invention is intended to provide a package for semiconductor components which achieves a significantly higher package loading through lower thermomechanical stress and, at the same time, a significantly better adhesion of the moulding covering on the substrate. This is achieved by virtue of the fact that the substrate (1) has, at least partially, a sponge-like structure (7) which is provided with porous openings and extends from the surface into the depth, so that moulding material can penetrate into the substrate (1) through capillary action. |
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Bibliography: | Application Number: TW20030116203 |