Dielectric material and dielectric sintered body, and wiring board using the same

• Main Authors: SUMI, HIROSHI, MIZUTANI, HIDETOSHI, SATO, MANABU, SAKAI, TSUTOMU, SUZUMURA, MJASASHI
• Format: Patent
• Language: English
• Published: 01.09.2005
• Edition: 7
• Subjects: BASIC ELECTRIC ELEMENTS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CHEMICAL COMPOSITION OF GLASSES, GLAZES, OR VITREOUSENAMELS; CHEMISTRY; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; GLASS; JOINING GLASS TO GLASS OR OTHER MATERIALS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; METALLURGY; MINERAL OR SLAG WOOL; PRINTED CIRCUITS; SEMICONDUCTOR DEVICES; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS,MINERALS OR SLAGS; SURFACE TREATMENT OF GLASS

A dielectric material comprising: a glass powder constituted of a glass comprising Si, B and an alkali metal element, the glass being amorphous in sintering at a temperature of 1,050 DEG C or lower; and a ceramic filler comprising at least one member of SiO2, Al2O3 and 3Al2O3.2SiO2, and an alkali metal element, wherein when a total sum of Si converted into SiO2, B converted into B2O3 and the alkali metal element converted into A2O, wherein A represents an alkali metal element, all of which are contained in the glass, is 100 mole%, the content of the alkali metal element converted into A2O, which is contained in the glass, is 0.5 mole% or less; and when a total sum of at least one member of SiO2, Al2O3 and 3Al2O3.2SiO2, and the alkali metal element converted into A2O, all of which are contained in the ceramic filler, is 100 mole%, a content of the alkali metal element converted into A2O, which is contained in the ceramic filler, is 0.5 mole% or less.