Preparation method of heat-dissipation structure for LED

One kind of preparation method of heat-dissipation structure for LED includes: providing one continuous-transporting thin substrate; punching the afore-mentioned thin substrate, by a punching mechanism, to form a pod containing one continuous and cathode/anode main bodies; and after the afore-mentio...

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Bibliographic Details
Main Author HUNG, MING-SHAN
Format Patent
LanguageEnglish
Published 11.08.2005
Edition7
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:One kind of preparation method of heat-dissipation structure for LED includes: providing one continuous-transporting thin substrate; punching the afore-mentioned thin substrate, by a punching mechanism, to form a pod containing one continuous and cathode/anode main bodies; and after the afore-mentioned pod subject to punching formation, the un-trimming thin waste material existing within the afore-mentioned cathode body being under preparation stage, by utilizing the extruding mechanism, to be extruded into the heat-dissipation structure with a certain thickness, which can be streamlined with the cathode body to form a whole.
Bibliography:Application Number: TW20040139100