Planarized plastic package modules for integrated circuits

A semiconductor module includes a semiconductor chip, a lead frame having lead fingers, and a down set member within an encapsulant for reduce warpage and providing 5a more planar package by balancing thermal stress between the lead fingers and the encapsulant. The down set member can be a bent port...

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Bibliographic Details
Main Authors CINCOTTA, JOHN P, CALETKA, DAVID V, CARPER, JAMES L, HORSFORD, KIBBY B, IRISH, GARY H.
Format Patent
LanguageEnglish
Published 11.04.2005
Edition7
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:A semiconductor module includes a semiconductor chip, a lead frame having lead fingers, and a down set member within an encapsulant for reduce warpage and providing 5a more planar package by balancing thermal stress between the lead fingers and the encapsulant. The down set member can be a bent portion of the lead frame. It can also be a separate body, such as a dummy semiconductor chip.
Bibliography:Application Number: TW200190115294