Manufacture method of epoxy resin formed material of encapsulated semiconductor, forming material and semiconductor apparatus thereof

This invention supplies a manufacture method of epoxy resin formed material of encapsulated semiconductor with less vacant space generation, its forming material by using the method, and semiconductor apparatus encapsulated by using the formed material. In other word, it supplies the pre-mixed mater...

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Bibliographic Details
Main Authors ANAI, YOSHIYUKI, TAKAYAMA, KENJI, TAKASAKI, NORIYUKI
Format Patent
LanguageEnglish
Published 11.02.2005
Edition7
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:This invention supplies a manufacture method of epoxy resin formed material of encapsulated semiconductor with less vacant space generation, its forming material by using the method, and semiconductor apparatus encapsulated by using the formed material. In other word, it supplies the pre-mixed material composed at least of epoxy resin, phenol resin, and inorganic filler to get scattering powder with particle diameters of greater than 250 mum with 10 weight %, greater than 150 mum and less than 250 mum with 15 weight %, and less than 150 mum with 75 weight %, then characterize as enforcing melt mixing.
Bibliography:Application Number: TW199988123224