Lift-and support-equipment, processing method of a plate-formed substrate and equipment to process the plate-formed substrate

• Main Authors: ELYAAKOUBI, MUSTAPHA, SCHMITT, JACQUES
• Format: Patent
• Language: English
• Published: 01.12.2004
• Edition: 7
• Subjects: BASIC ELECTRIC ELEMENTS; CHEMICAL SURFACE TREATMENT; CHEMISTRY; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING MATERIAL WITH METALLIC MATERIAL; COATING METALLIC MATERIAL; DIFFUSION TREATMENT OF METALLIC MATERIAL; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL; METALLURGY; PLASMA TECHNIQUE; PRODUCTION OF ACCELERATED ELECTRICALLY-CHARGED PARTICLES OR OFNEUTRONS; PRODUCTION OR ACCELERATION OF NEUTRAL MOLECULAR OR ATOMICBEAMS; SEMICONDUCTOR DEVICES; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION

A lift-and support-equipment to operate and rest especially large-area plate-formed elements, especially in plasma-process-devices, specially with metallic base-plate is described, on which many dielectric pins are arranged, the pins can be descended into the pin-holes mounted in the base-plate and the plate-shaped element can rest on the ends of the pins for operation or during the plasma-processing, where the plate-shaped element can have electrostatic charges, and the diameter of the pins or pin-holes is selected so small that adapted to the plate-shaped element having electrostatic charges undesired electrostatic charges on the plate-shaped element is avoided or adapted to the plate-shaped element processed by the plasma an interference of the plasma in the regions of the pin-holes or pins can be avoided.