Mechanism opening and closing a die of a resin seal apparatus

• Main Author: AMAKAWA, TSUYOSHI
• Format: Patent
• Language: English
• Published: 21.03.2004
• Edition: 7
• Subjects: AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING; BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; PERFORMING OPERATIONS; SEMICONDUCTOR DEVICES; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR; SHAPING OR JOINING OF PLASTICS; TRANSPORTING; WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL

A die opening and closing mechanism includes a bottom die block (1) fixed to a lower plate (2), a top die block (3) fixed to an upper plate (4), a bottom plate (6) integrally linked to the upper plate (4), a tie bar (7) provided to slide the lower plate (2), the upper plate (4) and the bottom plate (6), a mechanism (10) driving the lower plate (2), a link mechanism (11) connecting the bottom plate (6) and the lower plate (2) together and reversing in direction a driving force imparted for the lower plate (2), and transferring it to the bottom plate (6), and a pinch roller (19) fixed to a base (9) via attachment (20, 21). The pinch roller (19) fixed independent from the die allows the wired base material (17) to keep a position, in height, invariable whether the die is opened or closed. The wired base material (17) can thus have a loop (22) minimized. The die opening and closing mechanism can thus minimize the loop of the wired base material (17) to provide a wire free of distortion and accommodate the wired base material (17) large in thickness, and also provide a miniaturized apparatus.