Method for removing waste particle

In the conventional art, there has been no effective method for filtering the drainage occurred in mechanical processing, such as CMP. The drainage is in colloid solution state because the grind particles contained in the CMP slurry are fine particles. In the present invention, which provides a meth...

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Bibliographic Details
Main Authors IINUMA, HIROFUMI, TSUIHIJI, MOTOYUKI, UMEZAWA, HIROYUKI, ISEKI, MASAHIRO
Format Patent
LanguageEnglish
Published 21.12.2003
Edition7
Subjects
BASIC ELECTRIC ELEMENTS
CHEMISTRY
DRESSING OR CONDITIONING OF ABRADING SURFACES
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
GRINDING
MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING
METALLURGY
PERFORMING OPERATIONS
PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
POLISHING
SEMICONDUCTOR DEVICES
SEPARATION
TRANSPORTING
TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
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Summary:In the conventional art, there has been no effective method for filtering the drainage occurred in mechanical processing, such as CMP. The drainage is in colloid solution state because the grind particles contained in the CMP slurry are fine particles. In the present invention, which provides a method for removing waste particle, the drainage containing the fine particles of the colloid solution is filtered by means of a second filter 2, which is formed by a gel film being disposed on the surface of a first filter 1 by suction. The suction pressure while filtering is extremely weakened in order to keep a constant filtration, so that the blockage of the second filter 2 may be delayed to maintain filterability. As a result, fine particles mainly below 0.15 mum are able to be removed.
Bibliography:Application Number: TW200291123660