Semiconductor package and method of preparing same

A semiconductor package comprising a wafer having an active surface comprising at least one integrated circuit, wherein each integrated circuit has a plurality of bond pads; and a cured silicone layer covering the active surface of the wafer, provided at least a portion of each bond pad is not cover...

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Bibliographic Details
Main Authors GARDNER, GEOFFREY BRUCE, SARMAH, SATYENDRA KUMAR, MALENFANT, LOUISE ANN, BECKER, GREGORY SCOTT, HARKNESS, BRIAN ROBERT
Format Patent
LanguageEnglish
Published 21.11.2003
Edition7
Subjects
APPARATUS SPECIALLY ADAPTED THEREFOR
BASIC ELECTRIC ELEMENTS
CINEMATOGRAPHY
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
ELECTROGRAPHY
HOLOGRAPHY
MATERIALS THEREFOR
ORIGINALS THEREFOR
PHOTOGRAPHY
PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES
PHYSICS
SEMICONDUCTOR DEVICES
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Summary:A semiconductor package comprising a wafer having an active surface comprising at least one integrated circuit, wherein each integrated circuit has a plurality of bond pads; and a cured silicone layer covering the active surface of the wafer, provided at least a portion of each bond pad is not covered with the silicone layer and wherein the silicone layer is prepared by the method of the invention.
Bibliography:Application Number: TW200291101261