Electronic component, component mounting equipment, and component mounting method

The component mounting equipment (30) mounts an FPC board (12) on an LCD board (11). The LCD board (11) has a first electrode section (11b) on one side edge and a second electrode section (11c) on another side edge. The FPC board (12) has a first section (12a) on one side edge and a second section (...

Full description

Saved in:
Bibliographic Details
Main Authors KANAYAMA, SHINJI, NISHIMOTO, TOMOTAKA, TSUJI, SHINJIRO, IDA, MASAYUKI, NISHINO, KENICHI
Format Patent
LanguageEnglish
Published 01.06.2003
Edition7
Subjects
ADVERTISING
BASIC ELECTRIC ELEMENTS
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
CRYPTOGRAPHY
CURRENT COLLECTORS
DEVICES OR ARRANGEMENTS, THE OPTICAL OPERATION OF WHICH ISMODIFIED BY CHANGING THE OPTICAL PROPERTIES OF THE MEDIUM OF THEDEVICES OR ARRANGEMENTS FOR THE CONTROL OF THE INTENSITY,COLOUR, PHASE, POLARISATION OR DIRECTION OF LIGHT, e.g.SWITCHING, GATING, MODULATING OR DEMODULATING
DISPLAY
DISPLAYING
EDUCATION
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
FREQUENCY-CHANGING
LABELS OR NAME-PLATES
LINE CONNECTORS
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
NON-LINEAR OPTICS
OPTICAL ANALOGUE/DIGITAL CONVERTERS
OPTICAL LOGIC ELEMENTS
OPTICS
PHYSICS
PRINTED CIRCUITS
SEALS
SEMICONDUCTOR DEVICES
SIGNS
TECHNIQUES OR PROCEDURES FOR THE OPERATION THEREOF
Online AccessGet full text

Cover

More Information
Summary:The component mounting equipment (30) mounts an FPC board (12) on an LCD board (11). The LCD board (11) has a first electrode section (11b) on one side edge and a second electrode section (11c) on another side edge. The FPC board (12) has a first section (12a) on one side edge and a second section (12b) on other side edge. A first mounting apparatus (31) mounts the first section (12a) on the first electrode section (11b). A second mounting apparatus (32) mounts the second section (12b) on the second electrode section (11c). In the second component mounting apparatus (32), the second section (12b) is separated from the second electrode section (11b) at an ACF supply section (170) and released at a pre-press bonding section (180).
Bibliography:Application Number: TW200190126418