Testing system and manufacturing method of semiconductor integrated circuit device

• Main Authors: SHIMIZU, ISAO, SATO, MASAYUKI, FUKIAGE, HIROSHI
• Format: Patent
• Language: English
• Published: 01.05.2003
• Edition: 7
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MEASURING; MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES; PHYSICS; SEMICONDUCTOR DEVICES; TESTING

For the testing circuit constructed on the wafer formed by the probing test card or the tested semiconductor chip in the invention, a test is performed by electrically connecting the testing circuit with the tested semiconductor chip such that it is capable of executing the test without using a test...