Apparatus for supporting a substrate and method of fabricating same

Apparatus for protecting a substrate and a support surface of a substrate support chuck comprising a protective coating of a diamond-like carbon-based material deposited upon the support surface. The protective coating may also contain silicon-based materials. The protective coating is deposited via...

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Bibliographic Details
Main Authors SANSONI, STEVEN, CROCKER, STEVEN C, BROWN, KARL
Format Patent
LanguageEnglish
Published 11.01.2003
Edition7
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:Apparatus for protecting a substrate and a support surface of a substrate support chuck comprising a protective coating of a diamond-like carbon-based material deposited upon the support surface. The protective coating may also contain silicon-based materials. The protective coating is deposited via plasma-enhanced CVD and is approximately in the range of 1-5 m thick. The apparatus may also have a wafer spacing mask disposed upon the protective coating. A method of fabricating a substrate support chuck is also disclosed and comprises the steps of forming a chuck body having a support surface and depositing a carbon-based material over the support surface of said chuck body to form a protective coating. Optionally, a step of depositing a wafer spacing mask upon the protective coating may be added. The protective coating results in a substantial decrease in contamination of chucks, wafers and the process chamber environment.
Bibliography:Application Number: TW20010114662