Metal contamination method of wet platform

• Main Authors: PENG, JIANG-REN, SU, YU-SHENG, SU, BIN-JIA, WU, WEN-LANG
• Format: Patent
• Language: English
• Published: 11.10.2002
• Edition: 7
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

This invention relates to a metal contamination method of wet platform used to automatically detect any metal particles on the wafer surface before transferring the wafer into the wet platform from outside of the wet platform. The method consists of the following steps: firstly, providing a plural n...