Metal contamination method of wet platform

• Main Authors: PENG, JIANG-REN, SU, YU-SHENG, SU, BIN-JIA, WU, WEN-LANG
• Format: Patent
• Language: English
• Published: 11.10.2002
• Edition: 7
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

This invention relates to a metal contamination method of wet platform used to automatically detect any metal particles on the wafer surface before transferring the wafer into the wet platform from outside of the wet platform. The method consists of the following steps: firstly, providing a plural number of sampling apparatuses to obtain particle characteristic values on a wafer placed on a carrier; providing a coupling device to couple the above-mentioned sampling device with an analytical device of a particle counter in the wet platform to transfer the particle characteristic values to the analytical device; and providing a rotary support base coupling to the carrier which transport the wafer on the carrier from outside of the platform into the platform only if the number of the particle count of the wafer is not larger than the set value in the analytical device. In other words, if the number of the particles on a wafer is larger than the preset value, the wafer will not be transported into the platform.