Integrated method and apparatus for forming an enhanced capacitor

• Main Authors: NARWANKAR, PRAVIN, URDAHL, S. RANDALL, SAHIN, TURGUT
• Format: Patent
• Language: English
• Published: 11.02.2002
• Edition: 7
• Subjects: BASIC ELECTRIC ELEMENTS; CHEMICAL SURFACE TREATMENT; CHEMISTRY; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING MATERIAL WITH METALLIC MATERIAL; COATING METALLIC MATERIAL; DIFFUSION TREATMENT OF METALLIC MATERIAL; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL; METALLURGY; SEMICONDUCTOR DEVICES; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION

A novel method and apparatus for forming a capacitor is described. According to the present invention, a substrate having a bottom electrode is provided. A metal-oxide dielectric film is then formed on the bottom electrode. The metal-oxide dielectric film is annealed with remotely generated radicals. A metal-nitride layer is then formed on the annealed metal-oxide dielectric film. A top electrode is then formed on the metal-nitride barrier layer.