Wafer fabrication data acquisition and management systems

The present invention provides a semiconductor processing device (800) including a tool (802) having one or more sensors, a primary data communication port (804) and a secondary data communication port (806). A sensor data acquisition subsystem (808) acquires sensor data from the tool via the second...

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Bibliographic Details
Main Authors LOUNEVA, INNA+, CORDOVA, SHERRY, DOYLE, TERRY L, LOBOVSKI, EVGUENI, KROUPNOVA, NATALIA
Format Patent
LanguageEnglish
Published 21.01.2002
Edition7
Subjects
BASIC ELECTRIC ELEMENTS
CONTROL OR REGULATING SYSTEMS IN GENERAL
CONTROLLING
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
FUNCTIONAL ELEMENTS OF SUCH SYSTEMS
MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS ORELEMENTS
PHYSICS
REGULATING
SEMICONDUCTOR DEVICES
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Summary:The present invention provides a semiconductor processing device (800) including a tool (802) having one or more sensors, a primary data communication port (804) and a secondary data communication port (806). A sensor data acquisition subsystem (808) acquires sensor data from the tool via the secondary port (806). The data acquisition subsystem (808) acquires MES operation messages via the primary port (804). Sensor data are communicated to a sensor processing unit (828) of a sensor data processing subsystem (810). The sensor processing unit (828) processes and analyzes the sensor data. Additionally, the processing unit (828) can be adapted for making product or processing related decisions, for example activating an alarm if the process is not operating within control limits. In another embodiment, the present invention provides a method and apparatus for processing data from a wafer fab facility (1000) including a plurality of tools (1004-1010) each having a primary data communication port (1012-1018) and a secondary data communication port (1042-1048).
Bibliography:Application Number: TW200190100802