Saw device and manufacturing method therefor

In the SAW device of the invention, a SAW element 13 is assembled into a package member 10. The SAW element 13 includes a piezoelectric substrate plate 14 having IDT electrodes 15, connecting electrodes 16, base metal layers 17, sound absorbing materials 18 formed on the base metal layers 17 and hav...

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Bibliographic Details
Main Authors KOGA, TAKAFUMI, MATSUO, SATOSHI, TSUZUKI, SHIGERU, FUJII, KUNIHIRO, TAKADA, MASAHIRO
Format Patent
LanguageEnglish
Published 01.09.2001
Edition7
Subjects
BASIC ELECTRONIC CIRCUITRY
ELECTRICITY
IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS
RESONATORS
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Summary:In the SAW device of the invention, a SAW element 13 is assembled into a package member 10. The SAW element 13 includes a piezoelectric substrate plate 14 having IDT electrodes 15, connecting electrodes 16, base metal layers 17, sound absorbing materials 18 formed on the base metal layers 17 and having a uniform height and a surface parallel to a major surface of the piezoelectric substrate plate 14, the connecting electrodes 16 and external connecting electrodes 11 of the package member 10 being connected by metallic fine strings 19 and sealed air-tightly by a lid 20. When using these SAW elements 13 to assemble into face-up package members 10 with a vacuum chuck 30, defective assembly due to damage of the piezoelectric substrate plate 14 can be prevented. Furthermore, when the SAW elements 13 having bumps 23 formed on the connecting electrodes 16 are assembled into face-down package members 10, poor electrical contact can be prevented.
Bibliography:Application Number: TW200089102065