Manufacture of board material

Disclosed is a manufacture of a board material, that uses a bakelite blank as the inner layer material, a plurality of wood plates and cotton papers as the intermediate layer material, and titanium powder paper as the cover layer material, which are heated and pressed to be tightly joined by means o...

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Bibliographic Details
Main Authors SHIE, YUNGNG, LIN, CHIUAN-SHU
Format Patent
LanguageEnglish
Published 21.07.2001
Edition7
Subjects
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Summary:Disclosed is a manufacture of a board material, that uses a bakelite blank as the inner layer material, a plurality of wood plates and cotton papers as the intermediate layer material, and titanium powder paper as the cover layer material, which are heated and pressed to be tightly joined by means of a molding apparatus. The bakelite blank is made by mixing an appropriate portion of adhesives, with shredded wooden materials that are milled to wooden fibers of a 1-20 mm length, where dust is removed prior to adding the adhesives for stirring and mixing, and then being placed into a molding apparatus for a first pressing process. The intermediate layer material is made of at least two layers of wood plates of a 0.2-0.4 mm thickness, wherein the surface, the center and the bottom surface of the two wood plates are provided with cotton papers applied with adhesives. The cover layer material is titanium powder paper containing TiO2 that is pre-printed with various patterns and colors. The intermediate layer material and the cover layer material are placed above the inner layer material, followed by a second heating and pressing process to obtain a semi-product of a single face board material. The intermediate layer material and the cover layer material are than placed at the bottom of the single face board material, followed by a third heating and pressing process, followed by demolding, such that the inner layer, the intermediate layer and the cover layer are tightly joined and a protective film is formed on the surface so as to obtain a board material that is formed by planetary fibers with anti-abrasive characteristic without baking the board material.
Bibliography:Application Number: TW20000101606