Fabrication device for bonding layer, double-sided board, and multi-layer board

• Main Authors: KATO, KANJI, HAYASHI, HIDENORI, OCHI, AKIO, TANIZAKI, TOSHIO, WADA, AKIRA
• Format: Patent
• Language: English
• Published: 21.04.2000
• Edition: 7
• Subjects: CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; LAYERED PRODUCTS; LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PERFORMING OPERATIONS; PRINTED CIRCUITS; TRANSPORTING

This prevention discloses devices for bonding layer, double-sided board and multi-layer board fabrication. It provides precise, highly efficient and without electro-plating process for bonding layer, double-sided board and multi-layer board.